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LTCC
Embedded passives. Micro wave. Fine line
Please click here for more information
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Pacemakers,
Space, Military, RF
High rel.
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Thermoplastic
adhesives, glass seals
Low stress, high thermal conductivity, reworkable. Low sealing
temperatures.
For
power, HBLED, MEMS, wafer level sealing, hermetical sealing
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ACF,
NCF
Inorganic fillers for low TCE and high rel
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Assembly
- SMD and leaded components
5 Chinese factories. High quality and service
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"FLEX-FIXER"
re-usable carrier for flex
For processing of flex and thin PWBs. Stands 260C reflow. Also for ACF,
flip chip, wirebonding, dispensing, cure, reflow.
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