...the fascinating world of high density interconnect substrates, 
        MCM's, LTCC and thick film substrates                       
      - polymers for flipchip-, wafer- and CSP/BGA underfilling,
 glob tops and TAB, ACF, ACP, NCF, NCP           
- fine-line pastes - for screen printing or photodefined
         - conducting and non-conducting adhesives for die attach,  
       component and heat sink joining, power, HB LED        
           - glass sealing pastes or preforms for low temperature wafer 
             level sealing and hermetical sealing and for the attachment
of lenses or fibers to optical assemblies              

...high-end and high volume China outsourcing for surface mount
              assembly, box build, incl. wirebonding and flip chip services