| |
Companies Micronsult represents in e.g. Finland, Sweden, Norway & Denmark:
 |
High thermal
conductive adhesives, for die bonding and thermal mismatched
metal joining. Low modulus, reworkable. Glass sealing pastes
or preforms for low temp sealing and wafer level bonding Click
here for more information >> |
 |
ACF,
NCF. High reliability with or without inorganic filler.
For
flip chip assembly, flex-to-PCB, flex-to-flex in displays,
camera modules and handsets. Click
here for more information >>
|
 |
Re-usable carrier
for flex and thin (up to 0.3mm) flex PWBs. Saves expensive
clamping and vacuum tools. Stands up to 260C reflow. For flip
chip, wirebonding, ACF, UF dispensing, curing, solder
paste printing, etc. Click
here for more information >> |
 |
LTCC
and thick film. High end applications in RF &
Microwave. Space, Military, Telecom. Industrial.
Design. Assembly. Packaging. Hermetic. AOI. Test. Click
here for more information >>
|
 |
EMS - In the Asia top 10 of EMS providers.
Headquartered in Hong Kong.
5 factories in China.
Lead-free soldering. SMD, flip chip bonding, wirebonding.
Box
build.
ISO 9001. TS 16949. ISO 14001.
Click
here for more information >>
|
|
