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Products:
Conducting
and insulating materials for the electronics industry.
- Underfills, TAB coats, Glob tops.
- Conductive adhesives for flip chip bonding and solder
replacement.
- Conductive pastes for solar cells.
- Materials for PDP and LCD.
Applications:
Flip chips, BGA's, COB, TAB, TCP, component attach.
Termination materials and coating materials for passive
components.
News:
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Conductive
adhesives
for solder replacement.
Excellent reliability on FR4 and ceramics in tough
environments - like automotive
Versions for dispensing and screen printing
Versions for AgPd terminations
Versions for plated Sn terminated components and
substrate pads
Versions for non-ionic migration (AgSn filler) for plated Sn terminations
Excellent dispensing properties for high speed, small
dots & fine lines, long strings, no drip, etc.
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Die
bonding adhesives
Low-stress die attach adhesive for leadframes and substrates
High-temperature die attach adhesive for e.g. HB LEDs
High thermal conductivity die attach adhesives for power
devices
Sintering - no pressure - die attach types for power dies
Low temperature curing adhesives for PET etc. |
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Glob
tops - ordinary and low modulus
Dam & fill to stand lead-free soldering
Low modulus - low warpage types for stiff substrates (silicon,
glass, alumina/LTCC)
Glob tops for screen printing or dispensing |
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Image
sensor products
Adhesives for lens holder
Special dam for elimination of holder
Adhesives for glass lens
Die attach adhesives
Side-fill adhesives for image sensor (pre-applied types or
capillary types)
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Acid
anhydride-free epoxies
Acid anhydride-free CSP underfills, FC underfills and glob tops
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New CSP underfill products
New families offer extremely high productivity: very long potlife,
fast flow,
1 month potlife, storage in freezer not required
4-corner fixing product for devices which must not be
underfilled |
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Low
modulus - low warpage underfills
Underfills for low stress and resulting warpage on glass,
ceramics and silicon
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Ultra-fine
filler underfills
Underfills for gaps 10 µm or below. For e.g. ultra thin dies
with small bumps.
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No-flow underfills,
NCP, BNUF, pre-applied underfills
Pre-applied underfills: NCP's (Non
Conducting Pastes) for very fast cure under pressure and heat
(thermocompression)
NCP's suited for SiP (System in Package)
NCP's with JEDEC L3 performance (260C)
NCP's for gold bumps or solder bumps
NCP's for chip packages
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Wafer
applied/wafer level
underfills
Pre-applied underfills for wafer applications |
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Thermal conductive underfills
Underfills with high thermal conductivity for PA's etc.
Metallo organic pastes
Low temperature sintering pastes cured at 120C-300C
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Underfills
Fast cure and excellent fluidity. Long potlife
Extremely good adhesion - even after 168h at 85C/85%RH -
and very good moisture resistance
Other variants:
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Underfills for lead-free
solder temperatures and for
lead-free
solder
bumps
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Underfills for lead-free solder bumps, Cu pillar bumps and
low-k
IC dielectrics
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Underfills with high thermal conductivity for e.g. PA (GaAs) applications
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Low-modulus types
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Ultra-fine filler versions for very low gaps
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Compression flow types (pre-applied NCP). Extremely fast
cure. High reliability. Applications: chip-on-flex (COF) e.g. display drivers on flex
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No-flow, fluxing types for curing during solder reflow
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"Side-fill" products cured by both UV and heat. For components which cannot be underfilled
(SAW devices, imaging dies, etc.)
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Very high Tg types
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CSP
underfills
If bow, twist, TCT, Sn migration and drop test is an issue. In cellular phones - and in automotive applications!
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Very fast flow - also at very low gaps for LGA,
PoP, etc.
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Very long potlife - also at elevated temperatures - for max.
uptime of the dispenser
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Very fast cure
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Filled and unfilled versions
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For underfilling/fixing CSP's, BGA's, WLCSP's, MCM's
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Reworkable and non-reworkable types with 1 month potlife
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Storage in freezer is not required
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Glob
top
Very low substrate warpage, high moisture resistance,
very fast curing, stands
lead-free
soldering
Fill and dam types for co-curing and flat surface
For BGA's, MCM's and full substrate coatings for later
singulation
TAB
coat, TCP (Tape Carrier Package) materials
For LCD drivers and Tape-BGA
- Very good flow for very fine pitch. Fast cure
- Excelent adhesion to Kapton and Upilex. High reliability
SBB (Stud Bump
Bonding)
The SBB technology is illustrated in "Product
images & Applications" with a few Panasonic applications - CSP, CCD cameras,
radio, SBB on flex and MCM-L
Also shown the world's first full digital CIC hearing aid amplifier from Widex
- Denmark and a hearing aid amplifier on flex (PI) made by GNReSound
- Denmark
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NAMICS supplies SBB materials - adhesives &
underfills & prefix
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for applications on ceramic and organic boards - rigid
and flex
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New universal SBB underfills with 5 minute curing, new
SBB adhesives, new pre-fixes
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For up to 30 GHz, for thinned dies down to 80 µm, for stacking.
Extremely versatile
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SBB
for flip chip high volume economy; for high reliability; for easy
prototyping and
for reworkability
(KGD-issues) |
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Single chip, fraction of wafer or full wafer
bumping. |
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Bumping of any gold
wirebondable bare die |
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No UBM required |
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No re-distribution layers needed |
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LEAD-FREE,
LOW COST process |
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VERY FAST Time to Market
due to single chip bumping and easy process
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