...the fascinating world of high density interconnect substrates, 
        MCM's, LTCC and thick film substrates                       
    - polymers for flip chip underfilling - glob tops and TAB, 
 ACF, ACP, NCF, NCP                                        
- fine-line pastes - for screen printing or photodefined
         - conducting and non-conducting adhesives for diebonding,
       component and heat sink joining, power, HB LED        
           - glass sealing pastes or preforms for low temperature wafer 
             level sealing and hermetical sealing and for the attachment
of lenses or fibers to optical assemblies              
- NanoFoil bonding with localised heating......          

...high-end and high volume China outsourcing for surface mount
              assembly, box build, incl. wirebonding and flip chip services