Characteristics
- Design services
- Substrate manufacturing - LTCC, thick film
- Advanced assembly - SMD, CSP, Chip & Wire, Flip Chip
- Packaging - incl. hermitical packages
- AOI, Test, Lasering

Applications:
High reliability
- Medical - e.g. Pacemakers
- Avionics
- Automotive

RF & Microwave
- Radar
- LMDS

Telecom
- VCOs
- Filters
- 10/40 Gbit/s

Industrial
- Power control
- Sensors
- Display units