Thermally
conductive adhesives
Characteristics
-
Silver filled adhesives with up to 65 W/mK for die bonding or
bonding of thermal mismatched parts
- Solder replacement materials for SMD joining - reworkable
materials
- Electrically insulating adhesives for die bonding and heat sink
attachment
Applications:
- High power semiconductor die attach
- Power amplifiers
- High brightness LEDs
- Laser diodes
- Microprocessors
- Large area, large TCE mismatch bonding
- Heat sink attach
- High rel/military
- Automotive
- Solder replacement
Low temperature
sealing glasses
Characteristics
- Glasses to
hermetically seal optical and semiconductor components without
metallization
- Seals at temperatures as low as 320C in a few seconds
- Pastes or preforms
- Also lead free products
- Preforms to seal optical fibers, lenses, windows and lids in
photonic and semicondutor devices and sensors - replacing
solder seals with improved resistance to fatigue, creep and
corrosion - and eliminating needs for plating, flux and
special atmosphere requirements
- Standard or custom shapes
Applications:
- Sealing of optical fibers in ferrules and tubes
- Ribbon fiber sealing
- Sealing lenses in holders and package walls
- Wafer bonding and wafer level packaging
- Package lid sealing
- Via hole sealing
- (MEMS) sensor mounting and sealing
